View NCP623MN-40R2_3813579.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

? semiconductor components industries, llc, 2006 september, 2006 ? rev. 7 1 publication order number: ncp623/d ncp623 ultra low noise 150 ma low dropout voltage regulator with on/off control the ncp623 low dropout linear regulator can deliver up to 150 ma of output current with a typical dropout voltage of 180 mv. this low dropout feature helps to maintain a regulated output voltage for a longer period of time as the lifetime of the battery decreases. it is the ideal choice for noise sensitive environments like portable applications where noise performance and space are at a premium. the typical output noise voltage specification is 25 v rms . the space saving package choices include a micro8 ? or dfn6. an additional noise saving feature of this device is its ability to filter choppy signals on the power supply by providing a typical dc ripple rejection of ? 90 db and ? 70 db at 1.0 khz. the ncp623 is designed to work with very low esr capacitors such as ceramic capacitors which are common in the industry now. additional features such as thermal shutdown and short ? circuit protection provide for a robust system design. features ? very low quiescent current 170 a (on, no load), 100 na (off, no load) ? very low dropout voltage, typical value is 137 mv at an output current of 100 ma ? very low noise with external bypass capacitor (10 nf), typically 25 v rms over 100 hz to 100 khz ? internal thermal shutdown ? extremely tight line regulation typically ? 90 db ? ripple rejection ? 70 db @ 1.0 khz ? line transient response: 1.0 mv for v in = 3.0 v ? extremely tight load regulation, typically 20 mv at i out = 150 ma ? multiple output voltages available ? logic level on/off control (ttl ? cmos compatible) ? output capacitor esr can vary from 0 to 3.0 ? pb ? free packages are available applications ? all portable systems, battery powered systems, cellular telephones, radio control systems, toys and low voltage systems ? ? ? ?? ?? ?? pin connections see detailed ordering and shipping information on page 14 of this data sheet. ordering information lxx = device code (micro8) xx = see ordering information ncp623yy = device code (dfn6) yy = 25, 28, 30, 33, 40, or 50 a = assembly location l = wafer lot y = year w = work week = pb free package micro8 dm suffix case 846a marking diagrams 1 v out nc bypass nc on/off gnd v in gnd micro8 (top view) 1 2 3 4 8 7 6 5 dfn6, 3x3 mn suffix case 488ae dfn6 (top view) v in gnd v out on/off gnd bypass 1 2 3 6 5 4 ncp6 23yy alyw http://onsemi.com 1 ? ? ? 1 8 (note: microdot may be in either location)
ncp623 http://onsemi.com 2 gnd figure 1. ncp623 block diagram * current limit * antisaturation * protection v in v out gnd bypass band gap reference on/off on/off thermal shutdown maximum ratings rating symbol value unit power supply voltage v in 12 v power dissipation and thermal resistance maximum power dissipation p d internally limited w case 488ae (dfn6, 3x3) mn suffix thermal resistance, junction ? to ? air thermal resistance, junction ? to ? case case 846a (micro8) dm suffix thermal resistance, junction ? to ? air thermal resistance, junction ? to ? case r ja **psi ? jc* or jc r ja r jc 161 13 240 105 c/w operating ambient temperature range t a ? 40 to +85 c maximum junction temperature t jmax 150 c storage temperature range t stg ? 60 to +150 c esd protection ? human body model ? machine model v esd 2000 200 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. *?c?? (?case??) is defined as the solder ? attach interface between the center of the exposed pad on the bottom of the package, and the board to which it is attached. ** refer to the jedec specs (51 ? 2, 51 ? 6).
ncp623 http://onsemi.com 3 electrical characteristics (for typical values t a = 25 c, for min/max values t a = ? 40 c to +85 c, max t j = 150 c) characteristics symbol min typ max unit control electrical characteristics input voltage range v on/off 2.5 ? v in v on/off input current (all versions) v on/off = 2.4 v i on/off ? 2.5 ? a on/off input voltages (all versions) logic ?0?, i.e. off state logic ?1?, i.e. on state v on/off ? 2.2 ? ? 0.3 ? v currents parameters current consumption in off state (all versions) off mode current: v in = v out +1.0 v, i out = 0 ma iq off ? 0.1 2.0 a current consumption in on state (all versions) on mode sat current: v in = v out + 1.0 v, i out = 0 ma iq on ? 170 200 a current consumption in saturation on state (all versions) on mode sat current: v in = 2.5 v or v in = v out ? 0.4 v (whichever is hi gher), i out = 0 ma iq sat ? 900 1400 a current limit v in = v out + 1.0 v, (all versions) output short ? circuited (note 1) i max 175 210 ? ma v in = v out + 1.0 v, t a = 25 c, 1.0 ma < i out < 150 ma 2.5 suffix 2.8 suffix 3.0 suffix 3.3 suffix 4.0 suffix 5.0 suffix v out 2.45 2.74 2.94 3.23 3.92 4.90 2.5 2.8 3.0 3.3 4.0 5.0 2.55 2.86 3.06 3.37 4.08 5.1 v v in = v out + 1.0 v, ? 40 c < t a < 85 c 2.5 suffix 2.8 suffix 3.0 suffix 3.3 suffix 4.0 suffix 5.0 suffix v out 2.41 2.70 2.89 3.18 3.86 4.83 2.5 2.8 3.0 3.3 4.0 5.0 2.59 2.90 3.11 3.42 4.14 5.17 v line and load regulation, dropout voltages line regulation (all versions) v out + 1.0 v < v in < 12 v, i out = 60 ma reg line ? 2.0 10 mv load regulation (all versions) v in = v out + 1.0 v i out = 1.0 to 60 ma i out = 1.0 to 100 ma i out = 1.0 to 150 ma reg load ? ? ? 8.0 15 20 25 35 45 mv dropout voltage (all versions) i out = 10 ma i out = 100 ma i out = 150 ma v in ? v out ? ? ? 30 137 180 90 230 260 mv
ncp623 http://onsemi.com 4 electrical characteristics (for typical values t a = 25 c, for min/max values t a = ? 40 c to +85 c, max t j = 150 c) characteristics unit max typ min symbol dynamic parameters ripple rejection (all versions) v in = v out + 1.0 v, v pp = 1.0 v, f = 1.0 khz, i out = 60 ma 60 70 ? db line transient response v in = v out + 1.0 v to v out + 4.0 v, i out = 60 ma, d(v in )/dt = 15 mv/ s ? 1.0 ? mv output noise voltage (all versions) c out = 1.0 f, i out = 60 ma, f = 100 hz to 100 khz c bypass = 10 nf c bypass = 1.0 nf c bypass = 0 nf v rms ? ? ? 25 40 65 ? ? ? vrms output noise density c out = 1.0 f, i out = 60 ma, f = 1.0 khz v n ? 230 ? nv/ hz output rise time (all versions) c out = 1.0 f, i out = 30 ma, v on/off = 0 to 2.4 v 1% of on/off signal to 99% of nominal output voltage without bypass capacitor with c bypass = 10 nf t r ? ? 40 1.1 ? ? s ms thermal shutdown thermal shutdown (all versions) ? 150 ? c 1. i out (output current) is the measured current when the output voltage drops below 0.3 v with respect to v out at i out = 30 ma.
ncp623 http://onsemi.com 5 definitions load regulation ? the change in output voltage for a change in load current at constant chip temperature. dropout voltage ? the input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. measured when the output drops 100 mv below its nominal value (which is measured at 1.0 v differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. output noise voltage ? the rms ac voltage at the output with a constant load and no input ripple, measured over a specified frequency range. maximum power dissipation ? the maximum total dissipation for which the regulator will operate within specifications. quiescent current ? current which is used to operate the regulator chip and is not delivered to the load. line regulation ? the change in input voltage for a change in the input voltage. the measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. line transient response ? typical over ? and undershoot response when input voltage is excited with a given slope. thermal protection ? internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. when activated, typically 150 c, the regulator turns off. this feature is provided to prevent catastrophic failures from accidental overheating. maximum pa ckage power dissipation ? the maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 125 c. the junction temperature is rising while the difference between the input power (v cc x i cc ) and the output power (v out x i out ) is increasing. depending on ambient temperature, it is possible to calculate the maximum power dissipation, maximum load current or maximum input voltage (see application hints: protection). the maximum power dissipation supported by the device is a lot increased when using appropriate application design. mounting pad configuration on the pcb, the board material and also the ambient temperature are affected the rate of temperature rise. it means that when the i c has good thermal conductivity through pcb, the junction temperature will be ?low? even if the power dissipation is great. the thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). then you can calculate the power dissipation by subtracting the output power from the input power. all variables are then well known: power dissipation, thermal shutdown temperature (150 c for ncp623) and ambient temperature.
ncp623 http://onsemi.com 6 application hints input decoupling ? as with any regulator, it is necessary to reduce the dynamic impedance of the supply rail that feeds the component. a 1.0 f capacitor either ceramic or tantalum is recommended and should be connected close to the ncp623 package. higher values will correspondingly improve the overall line transient response. output decoupling ? output capacitors exhibiting esrs ranging from a few m up to 3.0 can safely be used. the minimum decoupling value is 1.0 f and can be augmented to fulfill stringent load transient requirements. the regulator works with ceramic chip capacitors as well as tantalum devices. noise performances ? unlike other ldos, the ncp623 is a true low ? noise regulator. with a 10 nf bypass capacitor, it typically reaches 25 vrms overall noise between 100 hz and 100 khz. spectral density graphics as well as noise dependency versus bypass capacitor information is included in this datasheet. the bypass capacitor impacts the startup phase of the ncp623 as depicted by the data ? sheet curves. a typical 1.0 ms settling time is achieved with a 10 nf bypass capacitor. however, due to its low ? noise architecture, the ncp623 can operate without bypass and thus offers a typical 20 s startup phase. in that case, the typical output noise stays lower than 65 vrms between 100 hz ? 100 khz. protections ? the ncp623 includes several protections functions. the output current is internally limited to a minimum of 175 ma while temperature shutdown occurs if the die heats up beyond 150 c. these value lets you assess the maximum differential voltage the device can sustain at a given output current before its protections come into play. the maximum dissipation the package can handle is given by: p max t jmax ?t a r ja if t jmax is internally limited to 150 c, then the ncp623 can dissipate up to 595 mw @ 25 c. the power dissipated by the ncp623 can be calculated from the following formula: ptot v in i gnd (i out ) v in v out i out or vin max ptot v out i out i gnd i out if a 150 ma output current is needed, the ground current is extracted from the data ? sheet curves: 6.5 ma @ 150 ma. for a ncp623nw28r2 (2.8 v), the maximum input voltage will then be 6.48 v, a rather comfortable margin. typical application ? the following figure portraits the typical application for the ncp623 where both input/output decoupling capacitors appear. figure 2. a typical ncp623 application with recommended capacitor values (dfn6) 64 123 input output c3 1.0 f c2 1.0 f c1 10 nf on/off ncp623 5 figure 3. a typical ncp623 application with recommended capacitor values (micro8) 87 5 12 4 output input c2 1.0 f c3 1.0 f c1 10 nf on/off ncp623 6 3 nc nc
ncp623 http://onsemi.com 7 ncp623 wake ? up improvement ? in portable applications, an immediate response to an enable signal is vital. if noise is not a concern, the ncp623 without a bypass capacitor settles in nearly 20 s and typically delivers 65 vrms between 100 hz and 100 khz. in ultra low ? noise systems, the designer needs a 10 nf bypass capacitor to decrease the noise down to 25 vrms between 100 hz and 100 khz. with the addition of the 10 nf capacitor, the wake ? up time expands up to 1.0 ms as shown on the data ? sheet curves. if an immediate response is wanted, figure 5 provides a solution to charge the bypass capacitor with the enable signal without degrading the noise response of the ncp623. at power ? on, c4 is discharged. when the control logic sends its wake ? up signal by going high, the pnp base is momentarily tied to ground. the pnp switch closes and immediately charges the bypass capacitor c1 toward its operating value. after a few s, the pnp opens and becomes totally transparent to the regulator. this circuit improves the response time of the regulator which drops from 1.0 ms down to 30 s. the value of c4 needs to be tweaked in order to avoid any bypass capacitor overload during the wake ? up transient. figure 4. a pnp transistor drives the bypass pin when enable goes high (dfn6) 13 ncp623 + + c2 1.0 f c3 1.0 f input output c4 470 pf c1 10 nf r2 220 k mmbt2902lt1 q1 on/off 2 64 5 figure 5. a pnp transistor drives the bypass pin when enable goes high (micro8) ncp623 + c2 1.0 f input output 75 6 8 24 3 1 + c3 1.0 f c1 10 nf on/off r2 220 k c4 470 pf mmbt2902lt1 q1
ncp623 http://onsemi.com 8 figure 6. ncp623 wake ? up improvement with small pnp transistor 1 ms 30 s ncp623 without wake ? up improvement (typical response) ncp623 with wake ? up improvement (typical response) the pnp connected to the bypass pin does not degrade the noise response of the ncp623. figure 7 displays the noise density using the setup in figure 5. the typical noise level is 26 v rm (100 hz to 25 khz) at i out = 60 ma. frequency (hz) nv/sqrt (hz) 100 1,000 350 200 150 100 1,000,000 50 10,000 figure 7. noise density of the ncp623 with a 10 nf bypass capacitor and a wake ? up improvement network 100,000 250 300 0 c byp = 10 nf v in = 3.8 v v out = 2.8 v c o = 1.0 f i out = 60 ma t amb = 25 c output noise = 26 vrms c = 10 nf @ 100 hz ? 100 khz
ncp623 http://onsemi.com 9 0 70 bypass capacitor (nf) frequency (hz) figure 8. noise density versus bypass capacitor figure 9. rms noise versus bypass capacitor (100 hz ? 100 khz) 2.0 3.0 4.0 5.0 50 40 30 20 0 10 1.0 60 10 v in = 3.8 v v out = 2.8 v c o = 1.0 f i out = 60 ma t amb = 25 c 6.0 7.0 8.0 9.0 nv/hz 100 350 1000 10,000 250 200 150 100 0 1,000,000 300 50 100,000 v in = 3.8 v v out = 2.8 v c o = 1.0 f i out = 60 ma t amb = 23 c c byp = 10 nf 3.3 nf 0 nf typical performance characteristics vn = 65 vrms @ c bypass = 0 vn = 30 vrms @ c bypass = 3.3 nf vn = 25 vrms @ c bypass = 10 nf over 100 hz to 100 khz rms noise ( a) temperature ( c) figure 10. output voltage (2.8 v) versus temperature figure 11. output voltage (2.8 v) versus i out ? 40 2.805 output voltage (v) ? 20 0 40 100 2.795 2.790 2.785 2.780 2.770 2.775 20 80 60 2.800 output current (ma) 0 2.860 output voltage (v) 20 40 80 160 2.800 2.780 2.740 2.760 60 120 100 2.820 140 2.840 ? 40 c 25 c 85 c 1 ma 100 ma 60 ma 150 ma 2.965 2.970 2.975 2.980 2.985 2.990 2.995 3.000 3.005 3.010 3.015 ? 40 ? 20 0 20 40 60 80 100 temperature ( c) figure 12. output voltage (3.0 v) versus temperature output voltage (v) 1 ma 100 ma 60 ma 150 ma 2.94 2.96 2.98 3.00 3.02 3.04 3.06 0 20 40 60 80 100 120 140 160 temperature ( c) output voltage (v) figure 13. output voltage (3.0 v) versus i out ? 40 c 25 c 85 c
ncp623 http://onsemi.com 10 dropout (mv) ? 40 250 temperature ( c) i o (ma) figure 14. dropout voltage versus i out figure 15. dropout voltage versus temperature ? 20 0 20 150 100 0 100 200 50 40 60 80 dropout (mv) 10 60 250 200 150 100 0 150 50 100 typical performance characteristics 85 c 25 c ? 40 c 150 ma 100 ma 60 ma 10 ma ? 40 2.1 0 7.0 ambient temperature ( c) ground current (ma) figure 16. ground current versus output current output current (ma) figure 17. ground current versus ambient temperature v in = 3.8 v v out = 2.8 v c o = 1.0 mf t amb = 25 c ground current (ma) 20 40 100 ? 20 0 20 40 60 80 1.0 0 2.05 2.0 1.95 1.9 1.8 1.85 60 80 120 140 200 160 180 2.0 3.0 4.0 5.0 6.0 v in = 3.8 v v out = 2.8 v c o = 1.0 f i out = 60 ma figure 18. quiescent current versus temperature ? 40 200 temperature ( c) ? 20 110 100 02040 60 100 80 120 130 140 150 160 170 180 190 quiescent current on mode ( a)
ncp623 http://onsemi.com 11 bypass capacitor (nf) figure 19. output voltage settling time versus bypass capacitor figure 20. output voltage settling shape c bypass = 10 nf v in = 3.8 v v out = 2.8 v c o = 1.0 f i out = 60 ma t amb = 25 c v in = 3.8 v v out = 2.8 v c out = 1.0 f i out = 50 ma t amb = 25 c figure 21. output voltage settling shape c bypass = 3.3 nf figure 22. output voltage settling shape without bypass capacitor 0 1200 1.0 2.0 3.0 4.0 6.0 10 1000 800 600 400 0 200 5.0 7.0 9.0 8.0 200 s/div 500 mv/div c byp = 10 nf v in = 3.8 v v out = 2.8 v c out = 1.0 f i out = 50 ma t amb = 25 c 100 s/div 500 mv/div c byp = 3.3 nf v in = 3.8 v v out = 2.8 v c out = 1.0 f i out = 50 ma t amb = 25 c 10 s/div 500 mv/div c byp = 0 nf settline time ( a) typical performance characteristics
ncp623 http://onsemi.com 12 typical performance characteristics figure 23. line transient response dv in = 3.2 v y2 y1 v in = 3.8 to 7.0 v y1 = 1.0 mv/div y2 = 1.0 v/div x = 1.0 ms i out = 60 ma t amb = 25 c y1: output current, y2: output voltage y1: output current, y2: output voltage figure 24. i out = 3.0 ma to 150 ma figure 25. i slope = 100 ma/ s (large scale) i out = 3.0 ma to 150 ma v in = 3.8 v y1 = 100 mv/div y2 = 20 mv/div x = 200 s/div t amb = 25 c y2 y1 v in = 3.8 v y1 = 50 ma/div y2 = 20 mv/div x = 20 s t amb = 25 c y2 y1 y1: output current, y2: output voltage y1: output current, y2: output voltage figure 26. i slope = 6.0 ma/ s (large scale) i out = 3.0 ma to 150 ma figure 27. i slope = 2.0 ma/ s (large scale) i out = 3.0 ma to 150 ma v in = 3.8 v y1 = 50 ma/div y2 = 20 mv/div x = 100 s t amb = 25 c y2 y1 v in = 3.8 v y1 = 50 ma/div y2 = 20 mv/div x = 200 s t amb = 25 c y2 y1
ncp623 http://onsemi.com 13 output capacitor esr figure 28. output stability versus output current over temperature (1.0 f, 3.0 v) output current (ma) 1.0 10 100 1000 0 10 20 30 40 50 60 70 80 90 100110 120130140150 unstable stable output capacitor esr figure 29. output stability with output capacitor change output current (ma) 150 f 1.0 f 0.1 f 0.01 0.1 1.0 10 100 0 10 20 30 40 50 60 70 80 90 100110 120130140150 output capacitor esr figure 30. output stability versus output current over temperature (150 f, 3.0 v) output current (ma) ? 40 c 25 c 85 c c out = 150 f v out = 3.0 v unstable stable figure 31. ripple rejection versus frequency with 10 nf bypass capacitor frequency (hz) v in = 3.8 v v out = 2.8 v c o = 1.0 f i out = 60 ma t amb = 25 c 100 0 (db) 1000 100,000 ? 10 ? 60 ? 70 ? 80 ? 100 ? 90 10,000 ? 20 ? 30 ? 40 ? 50 0.01 0.10 1.0 10 100 0 10 20 30 40 50 60 70 80 90 100110 120130140150 85 c 25 c ? 40 c c out = 1.0 f v out = 3.0 v unstable stable figure 32. ripple rejection versus frequency without bypass capacitor frequency (hz) v in = 3.8 v v out = 2.8 v c o = 1.0 f i out = 60 ma t amb = 25 c 10 0 (db) 1000 100,000 ? 60 ? 80 ? 120 10,000 ? 20 ? 40 100 1,000,000 ? 100 0.01 0.10 1.0 10 100 0 10 20 30 40 50 60 70 80 90 100110120130140150 ? 40 c 25 c 85 c c out = 0.0 f v out = 3.0 v unstable stable 25 c 85 c ? 40 c unstable output capacitor esr figure 33. output stability versus output current over temperature (0.1 f, 3.0 v) output current (ma)
ncp623 http://onsemi.com 14 ordering information device version marking package shipping ? ncp623dm ? 28r2g 2.8 v lja micro8 (pb ? free) 4000 tape & reel ncp623dm ? 30r2g 3.0 v lbj micro8 (pb ? free) ? 33r2 ncp623dm ? 33r2g 3.3 v lfw micro8 (pb ? free) ? 40r2 ? 40r2g ? free) ? 50r2 ncp623dm ? 50r2g 5.0 v lfx micro8 (pb ? free) ncp623mn ? 25r2g 2.5 v 25 dfn6, 3x3 (pb ? free) 3000 tape & reel ? 28r2g ? free) ncp623mn ? 30r2g 3.0 v 30 dfn6, 3x3 (pb ? free) ? 33r2 ? 40r2 ncp623mn ? 40r2g 4.0 v 40 dfn6, 3x3 (pb ? free) ? 50r2
ncp623 http://onsemi.com 15 package dimensions micro8 case 846a ? 02 issue g s b m 0.08 (0.003) a s t notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. 846a?01 obsolete, new standard 846a?02. b e pin 1 id 8 pl 0.038 (0.0015) ? t ? seating plane a a1 c l *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 8x 8x 6x mm inches scale 8:1 1.04 0.041 0.38 0.015 5.28 0.208 4.24 0.167 3.20 0.126 0.65 0.0256 dim a min nom max min millimeters ?? ?? 1.10 ?? inches a1 0.05 0.08 0.15 0.002 b 0.25 0.33 0.40 0.010 c 0.13 0.18 0.23 0.005 d 2.90 3.00 3.10 0.114 e 2.90 3.00 3.10 0.114 e 0.65 bsc l 0.40 0.55 0.70 0.016 ?? 0.043 0.003 0.006 0.013 0.016 0.007 0.009 0.118 0.122 0.118 0.122 0.026 bsc 0.021 0.028 nom max 4.75 4.90 5.05 0.187 0.193 0.199 h e h e d d e
ncp623 http://onsemi.com 16 package dimensions 6 pin dfn, 3x3x0.9 case 488ae ? 01 issue b notes: 1. dimensions and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. 5. terminal b may have mold compound material along side edge. mold flashing may not exceed 30 microns onto bottom surface of terminal b. dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 b 0.18 0.30 d 3.00 bsc d2 2.25 2.55 e 3.00 bsc e2 1.55 1.85 e 0.65 bsc k 0.20 ??? l 0.30 0.50 d b e c 0.15 a c 0.15 2x 2x top view side view bottom view ? ? ? ? ? ? ? c 0.08 c 0.10 e 6x l k e2 d2 b note 3 6x 0.10 c 0.05 c ab 6x ? ? ? ? ? ? ? ? 0.20 0.25 l1 0.00 0.021 ? ? ? detail b detail a 13 64 ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? ?? 3.31 0.130 0.63 0.025 0.65 0.025 0.35 0.014 2.45 0.964 1.700 0.685 exposed pad smd defined mm inches scale 10:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 ncp623/d micro8 is a trademark of international rectifier. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

▲Up To Search▲

Price & Availability of NCP623MN-40R2

	To Download NCP623MN-40R2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .